[CMake] Call for Participation - 5th International Conference on Cyber Security, Cyber Welfare and Digital Forensic
Jackie Blanco
jackie at sdiwc.info
Thu Nov 24 22:03:32 EST 2016
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Call for Participation
CyberSec2017: The Fifth International Conference on Cyber Security,
Cyber Welfare and Digital Forensic
22-24 April 2017, St. Mary's University, Addis Ababa, Ethiopia
https://goo.gl/mbDr7F
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You are cordially invited to participate the 5th International
Conference on Cyber Security, Cyber Welfare and Digital Forensic
(CyberSec2017).
CyberSec aims to enable researchers build connections between different
digital applications and engineering. The event will be held over three
days, with presentations delivered by researchers from the international
community, including presentations from keynote speakers and
state-of-the-art lectures.
The International Cyber Security, Cyber Welfare and Digital Forensic is
now on its fifth version as it is held annually in different countries.
As of year 2017, the first conference in Ethiopia with the coordination
of St. Mary's University and Society of Digital Information and Wireless
Communications will held the Fifth International Conference on Cyber
Security, Cyber Welfare and Digital Forensic (CyberSec2017). This
conference is looking forward for participation of delegates in
contribution to CyberSec field of topics. The conference welcomes papers
on the following research topics:
- Cyber Security
- Privacy issues
- Security in Cloud Computing
- Cyber Welfare
- Information Hiding
- Large-Scale Investigations
- Digital Forensic
- Fraud Management
- Laws and Regulations
- Cyber Crimes
- Security Protocol
- Social engineering
- Surveillance Systems
The conference uses double-blind review by at least two reviewers, which
means that both the reviewer and author identities are concealed from
the reviewers, and vice versa, throughout the review process. To
facilitate this, authors need to ensure that their manuscripts are
prepared in a way that does not give away their identity.
Full paper submission is due on March 1, 2017.
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